PART |
Description |
Maker |
0901200843 90120-0843 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, 3 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Vertical, 3 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective Plating MOLEX Connector
|
Molex Electronics Ltd.
|
0901210765 90121-0765 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, 5 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Right Angle, 5 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
001580-1123 15-80-1123 0015-80-1123 |
2.54mm Pitch C-Grid? Header
|
Molex Electronics Ltd.
|
0918143118 91814-3118 |
2.54mm (.100) Pitch C-Grid III Dual Row Right Angle Shrouded Header 2.54mm (.100) Pitch C-Grid III?/a> Dual Row Right Angle Shrouded Header 2.54mm (.100") Pitch C-Grid III垄芒 Dual Row Right Angle Shrouded Header
|
Molex Electronics Ltd.
|
SD-70287-003 |
2.54mm (.100) Pitch C-Grid? Header
|
Molex Electronics Ltd.
|
0901301128 90130-1128 |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 28 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni) 2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 28 Circuits, Black, 3楼矛m (118楼矛) Tin (Sn) over Nickel (Ni)
|
Molex Electronics Ltd.
|
0015800083-17 |
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
|
Molex Electronics Ltd.
|
0942422118 94242-2118 |
2.54mm (.100) Pitch, MOX Header, 3.50mm (.137) Grid, Through Hole 2.54mm (.100") Pitch, MOX Header, 3.50mm (.137") Grid, Through Hole
|
Molex Electronics Ltd.
|
0015800067-17 |
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
|
Molex Electronics Ltd.
|
0713086478 |
2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 78 Circuits, 1.50μm (59u) Minimum 2.54mm (.100") Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 78 Circuits, 1.50楼矛m (59u") Minimum
|
Molex Electronics Ltd.
|
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